Invention Grant
- Patent Title: Self-heating integrated circuit
- Patent Title (中): 自加热集成电路
-
Application No.: US12488484Application Date: 2009-06-19
-
Publication No.: US08358145B1Publication Date: 2013-01-22
- Inventor: Timothy A. Ferris , John R. Agness
- Applicant: Timothy A. Ferris , John R. Agness
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
Self-heating integrated circuits are provided. In one embodiment, a self-heating integrated circuit comprises a drive circuit configured to drive a device and a controller configured to selectively operate the drive circuit in a first mode or a second mode. In the first mode, the controller is configured to operate the drive circuit to drive the device and, in the second mode, the controller is configured to operate the drive circuit to heat the integrated circuit to a target temperature.
Information query
