Invention Grant
- Patent Title: Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate
- Patent Title (中): 电介质基板与介质基板中具有扼流结构的波导基板之间的波导连接
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Application No.: US12671627Application Date: 2008-07-31
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Publication No.: US08358185B2Publication Date: 2013-01-22
- Inventor: Kazuto Ohno , Takuya Suzuki , Shigeo Udagawa
- Applicant: Kazuto Ohno , Takuya Suzuki , Shigeo Udagawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-202272 20070802
- International Application: PCT/JP2008/063792 WO 20080731
- International Announcement: WO2009/017203 WO 20090205
- Main IPC: H01P1/04
- IPC: H01P1/04 ; H01P5/02

Abstract:
A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.
Public/Granted literature
- US20110187482A1 WAVEGUIDE CONNECTION STRUCTURE Public/Granted day:2011-08-04
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