Invention Grant
- Patent Title: Pattern shaping of RF emission patterns
- Patent Title (中): RF发射模式的模式整形
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Application No.: US13305609Application Date: 2011-11-28
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Publication No.: US08358248B2Publication Date: 2013-01-22
- Inventor: Victor Shtrom
- Applicant: Victor Shtrom
- Applicant Address: US CA Sunnyvale
- Assignee: Ruckus Wireless, Inc.
- Current Assignee: Ruckus Wireless, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Lewis and Roca LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24
Abstract:
A metallic shaping plate located in the interior housing of a wireless device is disclosed. The metallic shaping plate may influence a radiation pattern being generated by a horizontal antenna array. The result may be an increase in the gain of the array.
Public/Granted literature
- US20120068904A1 PATTERN SHAPING OF RF EMISSION PATTERNS Public/Granted day:2012-03-22
Information query
