Invention Grant
- Patent Title: Pattern inspection device and method of inspecting pattern
- Patent Title (中): 图案检查装置及检验方式
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Application No.: US12477666Application Date: 2009-06-03
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Publication No.: US08358340B2Publication Date: 2013-01-22
- Inventor: Ryoji Yoshikawa , Tomohide Watanabe , Hiromu Inoue , Hiroyuki Ikeda , Hiroyuki Tanizaki
- Applicant: Ryoji Yoshikawa , Tomohide Watanabe , Hiromu Inoue , Hiroyuki Ikeda , Hiroyuki Tanizaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2008-146871 20080604
- Main IPC: H04N7/18
- IPC: H04N7/18 ; H04N9/47

Abstract:
A pattern inspection device according to the embodiment, includes: an image picking-up portion for picking-up an image of a pattern formation member in which a plurality of opening patterns are formed so as to obtain a picked-up image of the pattern formation member; a reference image obtaining portion for obtaining a reference image used for comparing with the picked-up image; and a pattern defect detecting portion for matching the center locations of the opening pattern images respectively between the picked-up image and the reference image, forming difference images of the opening pattern images between the picked-up image and the reference image per the opening pattern and detecting the defect of the opening pattern base on the difference images.
Public/Granted literature
- US20090303323A1 PATTERN INSPECTION DEVICE AND METHOD OF INSPECTING PATTERN Public/Granted day:2009-12-10
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