Invention Grant
- Patent Title: Stackable module for energy-efficient computing systems
- Patent Title (中): 用于节能计算系统的可堆叠模块
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Application No.: US12789617Application Date: 2010-05-28
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Publication No.: US08358503B2Publication Date: 2013-01-22
- Inventor: John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
- Applicant: John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Francis Lammes; Stephen J. Walder, Jr.; Libby Z. Toub
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
Public/Granted literature
- US20110292597A1 Stackable Module for Energy-Efficient Computing Systems Public/Granted day:2011-12-01
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