Invention Grant
- Patent Title: Electronic board arrangement and electronic interconnect board of an electronic board arrangement
- Patent Title (中): 电子板布置和电子布线的电子互连板
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Application No.: US12205492Application Date: 2008-09-05
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Publication No.: US08358511B2Publication Date: 2013-01-22
- Inventor: Harald Huels , Dieter Staiger
- Applicant: Harald Huels , Dieter Staiger
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Mark E. McBurney
- Priority: EP07115783 20070906
- Main IPC: H01R12/16
- IPC: H01R12/16

Abstract:
The invention relates to an electronic-board arrangement, comprising at least two electronic boards, particularly integrated circuit boards, which are attached to a backplane which provides electrical interconnection between the at least two electronic boards. An electronic interconnect board providing electrical interconnect between the at least two electronic boards is arranged in a space in between the at least two electronic boards and the backplane.
Public/Granted literature
- US20090067146A1 Electronic Board Arrangement and Electronic Interconnect Board of an Electronic Board Arrangement Public/Granted day:2009-03-12
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