Invention Grant
- Patent Title: Band-splitting time compensation signal processing device
- Patent Title (中): 分段时间补偿信号处理装置
-
Application No.: US12744238Application Date: 2008-11-18
-
Publication No.: US08358790B2Publication Date: 2013-01-22
- Inventor: Kohei Teramoto , Masaru Kimura , Tsuyoshi Nakada
- Applicant: Kohei Teramoto , Masaru Kimura , Tsuyoshi Nakada
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-021218 20080131
- International Application: PCT/JP2008/003360 WO 20081118
- International Announcement: WO2009/095965 WO 20090806
- Main IPC: H03G5/00
- IPC: H03G5/00

Abstract:
A band-splitting time compensation signal processing device 2 includes a band-splitting circuit 211 for extracting, after extracting a signal of a high-frequency band component or low-frequency band component from an input signal, a signal of the low-frequency band component or high-frequency band component by subtracting the signal of the high-frequency band component or low-frequency band component from the input signal; a delay circuit 212 for delaying, for adjusting arrival time, at least one of the high-frequency band component and low-frequency band component output from the band-splitting circuit 211; and a mixing circuit 213 for combining the high-frequency band component or low-frequency band component output from the delay circuit 212 with the low-frequency band component or high-frequency band component output from the band-splitting circuit 211.
Public/Granted literature
- US20100260356A1 BAND-SPLITTING TIME COMPENSATION SIGNAL PROCESSING DEVICE Public/Granted day:2010-10-14
Information query