Invention Grant
- Patent Title: Thermal analysis apparatus
- Patent Title (中): 热分析仪
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Application No.: US12806997Application Date: 2010-08-25
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Publication No.: US08359180B2Publication Date: 2013-01-22
- Inventor: Kentaro Yamada
- Applicant: Kentaro Yamada
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2009-202092 20090901
- Main IPC: G01K17/00
- IPC: G01K17/00 ; G06F15/00

Abstract:
To avoid an influence on measurement accuracy in a case where an observation window for a measurement sample is provided to a thermal analysis apparatus, the influence being imposed by thermal conduction through the observation window, the observation window is formed of layers of transparent members, and a gap layer is provided between the layers, to thereby reduce the thermal conduction. Gas or solid having a high heat insulation property is employed for the gap layer to further enhance a heat insulation property of the observation window. Accordingly, a change due to heating of the measurement sample is visually observed in the thermal analysis apparatus, to thereby obtain a thermal change or a physical change with higher accuracy.
Public/Granted literature
- US20110054829A1 Thermal analysis apparatus Public/Granted day:2011-03-03
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