Invention Grant
US08359729B2 Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads
有权
一种用于制造包括连接到接触焊盘的应答器天线的装置的方法，其中将焊接能量直接施加到接触焊盘
- Patent Title: Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads
- Patent Title (中): 一种用于制造包括连接到接触焊盘的应答器天线的装置的方法，其中将焊接能量直接施加到接触焊盘
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Application No.: US12600483Application Date: 2008-05-13
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Publication No.: US08359729B2Publication Date: 2013-01-29
- Inventor: Jean-François Martinent , Laurence Robles , François Roussel
- Applicant: Jean-François Martinent , Laurence Robles , François Roussel
- Applicant Address: FR Gemenos
- Assignee: Gemalto SA
- Current Assignee: Gemalto SA
- Current Assignee Address: FR Gemenos
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP07301057 20070521
- International Application: PCT/EP2008/055859 WO 20080513
- International Announcement: WO2008/141982 WO 20081127
- Main IPC: H02P11/00
- IPC: H02P11/00
Abstract:
A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.
Public/Granted literature
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