Invention Grant
US08362366B2 Circuit board, its manufacturing method, and joint box using circuit board
失效
电路板，其制造方法和接线盒使用电路板
- Patent Title: Circuit board, its manufacturing method, and joint box using circuit board
- Patent Title (中): 电路板，其制造方法和接线盒使用电路板
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Application No.: US13006222Application Date: 2011-01-13
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Publication No.: US08362366B2Publication Date: 2013-01-29
- Inventor: Tsugio Ambo , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- Applicant: Tsugio Ambo , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Cable Industries, Ltd.
- Current Assignee: Mitsubishi Cable Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, P.C.
- Priority: JP2004-105997 20040331; JP2004-239707 20040819; JP2004-381266 20041228
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.
Public/Granted literature
- US20110116248A1 CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD Public/Granted day:2011-05-19
Information query
