A method for manufacturing a multilayer printed wiring board suitable for forming fine conductive circuits. A multilayer printed wiring board is formed with a first insulative material and a first conductive circuit formed on the first insulative material. A second insulative material is formed on the first insulative material and the first conductive circuit, and has an opening portion that reaches the first conductive circuit. A second conductive circuit is formed on the second insulative material and a via conductor is formed in the opening portion and connecting the first conductive circuit and the second conductive circuit. An insulative thin film is formed on at least part of the side surface of the first conductive circuit, and the via conductor is directly connected to the surface of the first conductive circuit exposed through the opening portion.