Invention Grant
- Patent Title: Resonator including a microelectromechanical system structure with first and second structures of silicon layers
- Patent Title (中): 谐振器包括具有硅层的第一和第二结构的微机电系统结构
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Application No.: US13012099Application Date: 2011-01-24
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Publication No.: US08362577B2Publication Date: 2013-01-29
- Inventor: Shogo Inaba , Akira Sato , Toru Watanabe , Takeshi Mori
- Applicant: Shogo Inaba , Akira Sato , Toru Watanabe , Takeshi Mori
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-338042 20061215
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A resonator with a microeletromechanical system structure has a transistor with a gate electrode, a capacitor with an upper and lower electrode, a substrate, a first and second structure of the microelectromechanical system structure, a first silicon layer of the first structure and the upper electrode formed above the substrate, a second silicon layer of the second structure and the gate electrode unit formed above the substrate, and an insulating film formed above the capacitor and the transistor, the insulating film having an opening for placement of the second structure.
Public/Granted literature
- US20110121908A1 Mems Resonator and Manufacturing Method of the Same Public/Granted day:2011-05-26
Information query
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