Invention Grant
- Patent Title: Method for optimized removal of wafer from electrostatic chuck
- Patent Title (中): 从静电卡盘优化晶片脱除的方法
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Application No.: US12372664Application Date: 2009-02-17
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Publication No.: US08363378B2Publication Date: 2013-01-29
- Inventor: Terry Bluck , Hizam Sahibudeen , Dennis Grimard
- Applicant: Terry Bluck , Hizam Sahibudeen , Dennis Grimard
- Applicant Address: US CA Santa Clara
- Assignee: Intevac, Inc.
- Current Assignee: Intevac, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Nixon Peabody LLP
- Agent Joseph Bach, Esq.
- Main IPC: H01T23/00
- IPC: H01T23/00
Abstract:
Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.
Public/Granted literature
- US20100208409A1 METHOD FOR OPTIMIZED REMOVAL OF WAFER FROM ELECTROSTATIC CHUCK Public/Granted day:2010-08-19
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