Invention Grant
- Patent Title: System and method for supplying power to electronics enclosures utilizing distributed DC power architectures
- Patent Title (中): 使用分布式DC电源架构为电子机箱供电的系统和方法
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Application No.: US12580498Application Date: 2009-10-16
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Publication No.: US08363388B2Publication Date: 2013-01-29
- Inventor: Jeffrey L. Wise , Pasi Jukka Vaananen , Stephen A. Hauser , James J. Dorsey
- Applicant: Jeffrey L. Wise , Pasi Jukka Vaananen , Stephen A. Hauser , James J. Dorsey
- Applicant Address: US WI Madison
- Assignee: Emerson Network Power—Embedded Computing, Inc.
- Current Assignee: Emerson Network Power—Embedded Computing, Inc.
- Current Assignee Address: US WI Madison
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01B7/30 ; H02J7/00

Abstract:
A power entry module (PEM) that is used with an electronics equipment enclosure. The PEM has a housing adapted to be coupled to a shelf of the electronics equipment enclosure. The housing has at least one pair of power cable lugs accessible from an exterior of the housing for coupling the PEM to a pair of power cables associated with a power feed. The PEM also has a backplane connector for coupling the PEM to a blackplane of the electronics enclosure. A distribution network is disposed within the PEM housing and forms at least a pair of electrically isolated power distribution buses for coupling electrical power provided from the power cables to each of the power distribution branches. Each power distribution branch independently provides electrical power to at least one blade supported within the electronics equipment enclosure.
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