Invention Grant
- Patent Title: Circuit module and electronic device using the same
- Patent Title (中): 电路模块和电子设备使用相同
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Application No.: US12982268Application Date: 2010-12-30
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Publication No.: US08363400B2Publication Date: 2013-01-29
- Inventor: Feng-Ku Wang , Chih-Kai Yang
- Applicant: Feng-Ku Wang , Chih-Kai Yang
- Applicant Address: TW
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: CN201010570525 20101126
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.
Public/Granted literature
- US20120134112A1 CIRCUIT MODULE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-05-31
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