Invention Grant
- Patent Title: Integrated device of heat dissipation unit and package component and a fastening structure for the same
- Patent Title (中): 散热单元和封装组件的集成装置及其紧固结构
-
Application No.: US13008663Application Date: 2011-01-18
-
Publication No.: US08363409B2Publication Date: 2013-01-29
- Inventor: Yi-Chiu Chung
- Applicant: Yi-Chiu Chung
- Applicant Address: TW New Taipei
- Assignee: Chicony Power Technology Co., Ltd.
- Current Assignee: Chicony Power Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The integrated device of a heat dissipation unit and a package component includes a non-insulation type package component, an insulation sheet, a heat dissipation unit, a fastener, a washer and a sleeve. The non-insulation package component has a metal tab with a through hole. The insulation sheet is provided with a via hole and attached on one side of the metal tab. The heat dissipation unit is provided with a tapped hole corresponding to the through hole. The sleeve includes a narrow portion penetrating the via hole and through and a wide portion sandwiched between the insulation sheet and heat dissipation unit. When the fastener penetrates into the through hole of the metal tab and the via hole of the insulation sheet and screws into the tapped hole, the fastener will pass through the sleeve without contact with the insulation sheet due to the protection of the narrow portion in the via hole.
Public/Granted literature
- US20120182691A1 INTEGRATED DEVICE OF HEAT DISSIPATION UNIT AND PACKAGE COMPONENT AND A FASTENING STRUCTURE FOR THE SAME Public/Granted day:2012-07-19
Information query