Invention Grant
- Patent Title: Passive, low-profile heat transferring system
- Patent Title (中): 被动,低调的传热系统
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Application No.: US13051930Application Date: 2011-03-18
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Publication No.: US08363411B2Publication Date: 2013-01-29
- Inventor: Matthew Stephens , Bhavesh Tailor , Stewart Marlow , Robert Legg
- Applicant: Matthew Stephens , Bhavesh Tailor , Stewart Marlow , Robert Legg
- Applicant Address: GB Keighley
- Assignee: Eldon Technology Limited
- Current Assignee: Eldon Technology Limited
- Current Assignee Address: GB Keighley
- Agency: Lowe Graham Jones PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.
Public/Granted literature
- US20120236506A1 PASSIVE, LOW-PROFILE HEAT TRANSFERRING SYSTEM Public/Granted day:2012-09-20
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