Invention Grant
- Patent Title: Headphones and earmuffs
- Patent Title (中): 耳机和耳罩
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Application No.: US12686571Application Date: 2010-01-13
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Publication No.: US08363877B2Publication Date: 2013-01-29
- Inventor: Rui Morisawa
- Applicant: Rui Morisawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2009-006097 20090114
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; A42B1/06 ; A42B1/08

Abstract:
There is provided a headphone comprising: a pair of right and left housings each for accommodating a speaker unit; a headband having a shape curved in a longitudinal direction to which the pair of right and left housings are connected on both sides in the longitudinal direction, respectively; and first to third hinges provided on the headband so as to be arranged in the longitudinal direction and capable of folding the headband in an inner side direction of curvature; wherein the first hinge positioned between the second and third hinges is capable of folding the headband about a hinge axis tilted relative to a forward and backward direction perpendicular to the longitudinal direction of the headband such that both ends in the longitudinal direction of the headband folded only by the first hinge do not contact each other.
Public/Granted literature
- US20100177907A1 HEADPHONES AND EARMUFFS Public/Granted day:2010-07-15
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