Invention Grant
- Patent Title: Lead assembly for implantable microstimulator
- Patent Title (中): 可植入微型激励器的导线组件
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Application No.: US10503281Application Date: 2003-01-29
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Publication No.: US08364278B2Publication Date: 2013-01-29
- Inventor: Anne M. Pianca , Todd K. Whitehurst , James P. McGivern
- Applicant: Anne M. Pianca , Todd K. Whitehurst , James P. McGivern
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Frommer Lawrence & Haug
- Agent Patrick R. Turner
- International Application: PCT/US03/02784 WO 20030129
- International Announcement: WO03/063951 WO 20030807
- Main IPC: A61N1/05
- IPC: A61N1/05

Abstract:
A lead assembly for a small implantable medical device connects a remote electrode to a microdevice and inhibits fluid ingress into the connection. Microdevices may provide either or both tissue stimulation and sensing. Known microdevices include spaced apart electrodes on the outer surface of the microdevice. The lead assembly includes an insulated lead including a proximal end and a distal end, with at least one conductor therebetween; at least one electrode at the distal end of the lead and electrically connected to the at least one conductor, and a connector attached to the proximal end of the lead and adapted to be removably connectable to the microdevice. The connector includes at least one contact to electrically connect at least one device electrode on the microdevice to the at least one conductor. The lead assembly is configured to inhibit fluid ingress into the connector.
Public/Granted literature
- US20050165465A1 Lead assembly for implantable microstimulator Public/Granted day:2005-07-28
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