Invention Grant
- Patent Title: Method for affixing adhesive films and main board with adhesive films applied using the method
- Patent Title (中): 使用该方法涂覆粘合剂膜和主板的粘合剂膜的方法
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Application No.: US12843073Application Date: 2010-07-26
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Publication No.: US08365390B2Publication Date: 2013-02-05
- Inventor: Hua-Lin Lv , Kok-Kan Chan , Ting-Jian Zou , Yu Zou , Kai-Gui Wang
- Applicant: Hua-Lin Lv , Kok-Kan Chan , Ting-Jian Zou , Yu Zou , Kai-Gui Wang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010152638 20100422
- Main IPC: G01R3/00
- IPC: G01R3/00

Abstract:
A method for affixing adhesive films to a main board is provided. The main board includes a main body and a shield. The shield includes a first shield and a second shield. The second shield defines openings. When the second shield is attached to the main body, components of the main body are confined within the openings, respectively. The method includes: first absorbing a single adhesive film to an electrostatic absorbing film. Then, stamping the electrostatic absorbing film and the single adhesive film to form adhesive films that have substantially the same shape and arrangement as the openings. Next, aligning the electrostatic absorbing film with the first shield and affixing the adhesive films to the first shield. Then, removing the electrostatic absorbing film from the first shield. And, assembling the first shield to the second shield.
Public/Granted literature
- US20110261552A1 METHOD FOR AFFIXING ADHESIVE FILMS AND MAIN BOARD WITH ADHESIVE FILMS APPLIED USING THE METHOD Public/Granted day:2011-10-27
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