Invention Grant
- Patent Title: Method of connecting components to a printed circuit board
- Patent Title (中): 将部件连接到印刷电路板的方法
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Application No.: US12630677Application Date: 2009-12-03
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Publication No.: US08365399B2Publication Date: 2013-02-05
- Inventor: Mark E. Andresen , Virginia Ott
- Applicant: Mark E. Andresen , Virginia Ott
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Thomas Tyson; Jeffrey L. Streets
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.
Public/Granted literature
- US20110134597A1 PRINTED CIRCUIT BOARD HAVING A NON-PLATED HOLE WITH LIMITED DRILL DEPTH Public/Granted day:2011-06-09
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