Invention Grant
US08365977B2 Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
有权
用于引线接合的超声换能器和使用超声波换能器形成线接合的方法
- Patent Title: Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
- Patent Title (中): 用于引线接合的超声换能器和使用超声波换能器形成线接合的方法
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Application No.: US13557925Application Date: 2012-07-25
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Publication No.: US08365977B2Publication Date: 2013-02-05
- Inventor: Dominick A. DeAngelis , Gary W. Schulze
- Applicant: Dominick A. DeAngelis , Gary W. Schulze
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K1/06
- IPC: B23K1/06 ; B29C65/08
Abstract:
A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
Public/Granted literature
- US20120286023A1 ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS Public/Granted day:2012-11-15
Information query
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