Invention Grant
- Patent Title: Coupling in and to RFID smart cards
- Patent Title (中): 耦合到RFID智能卡
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Application No.: US13310718Application Date: 2011-12-03
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Publication No.: US08366009B2Publication Date: 2013-02-05
- Inventor: David Finn , Klaus Ummenhofer
- Applicant: David Finn , Klaus Ummenhofer
- Applicant Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Assignee: Féinics AmaTech Teoranta
- Current Assignee: Féinics AmaTech Teoranta
- Current Assignee Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Agent Gerald E. Linden
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a “quasi-dipole”. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).
Public/Granted literature
- US20120074233A1 COUPLING IN AND TO RFID SMART CARDS Public/Granted day:2012-03-29
Information query
