Invention Grant
- Patent Title: Universal mounting apparatus
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Application No.: US12286619Application Date: 2008-10-01
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Publication No.: US08366064B2Publication Date: 2013-02-05
- Inventor: Wayne Chen , Adam Gold
- Applicant: Wayne Chen , Adam Gold
- Applicant Address: US NY New York
- Assignee: Adaptiv Technologies LLC
- Current Assignee: Adaptiv Technologies LLC
- Current Assignee Address: US NY New York
- Agent Raymond Sun
- Main IPC: F16M11/02
- IPC: F16M11/02

Abstract:
A ball-and-socket joint assembly includes a stationary object, a movable object, and a mounting apparatus. The mounting apparatus has first and second rigid link sections, each link section having an upper socket section and a lower socket section, so that an upper receiving space is defined by the two upper socket sections and a lower receiving space is defined by the two lower socket sections. The assembly further includes an upper coupler having an upper ball that is received for rotation inside the upper receiving space, with the movable object secured to the upper coupler, and a lower coupler having a lower ball that is received for rotation inside the lower receiving space, with the stationary object secured to the lower coupler. A link member secures the link sections together with the upper ball retained inside the upper receiving space, and with the lower ball retained inside the lower receiving space.
Public/Granted literature
- US20100078537A1 Universal mounting apparatus Public/Granted day:2010-04-01
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