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US08366294B2 Light-emitting device, light-emitting module, and method for manufacturing light-emitting device 失效
发光装置，发光模块以及发光装置的制造方法

  • Patent Title: Light-emitting device, light-emitting module, and method for manufacturing light-emitting device
  • Patent Title (中): 发光装置，发光模块以及发光装置的制造方法
  • Application No.: US13142171
    Application Date: 2009-12-16
  • Publication No.: US08366294B2
    Publication Date: 2013-02-05
  • Inventor: Tomoyuki Takei , Hisayuki Miki
  • Applicant: Tomoyuki Takei , Hisayuki Miki
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2008-331579 20081225
  • International Application: PCT/JP2009/070991 WO 20091216
  • International Announcement: WO2010/073950 WO 20100701
  • Main IPC: F21V7/00
  • IPC: F21V7/00 ;  H01L33/60
Light-emitting device, light-emitting module, and method for manufacturing light-emitting device
Abstract:
A light-emitting chip (22) includes: a container (30) having a concave portion (31); first to fourth lead portions (61) to (64), provided to be exposed to the concave portion (31); and a first blue LED to a fourth blue LED (74) mounted on the first to fourth lead portions (61) to (64) exposed to the concave portion (31). The container (30) includes a first container portion (40) covering the region of the concave portion (31) where the first to fourth lead portions (61) to (64) are not exposed, and a second container portion (50) contacting the first to fourth lead portions (61) to (64) without being exposed to the concave portion (31) and accommodating the first container portion (40). The first container portion (40) is formed of a material having higher light reflectivity than that of the second container portion (50), and the second container portion (50) is formed of a material having higher thermal conductivity than that of the first container portion (40). Thus, a decrease in extraction efficiency for light emitted from a light-emitting element can be suppressed, and a rise in the temperature of the light-emitting element in response to the light emission can be suppressed.
Abstract(Chinese):

发光芯片（22）包括：具有凹部（31）的容器（30） 第一至第四引线部分（61）至（64），设置为暴露于所述凹部（31）; 以及安装在暴露于凹部（31）的第一至第四引线部分（61）至（64）上的第四蓝色LED（74）的第一蓝色LED。 容器（30）包括覆盖第一至第四引线部分（61）至（64）不暴露的凹部（31）的区域的第一容器部分（40）和与第一容器部分（50）接触的第二容器部分 第一至第四引线部分（61）至（64），而不暴露于凹部（31）并容纳第一容器部分（40）。 第一容器部分（40）由具有比第二容器部分（50）的光反射率更高的光反射率的材料形成，并且第二容器部分（50）由比第一容器（50）的热导率更高的材料形成 部分（40）。 因此，可以抑制从发光元件发射的光的提取效率的降低，并且可以抑制响应于发光的发光元件的温度的升高。

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