Invention Grant
- Patent Title: Mold clamping device
- Patent Title (中): 模具夹紧装置
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Application No.: US12741848Application Date: 2008-04-09
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Publication No.: US08366438B2Publication Date: 2013-02-05
- Inventor: Naoki Kato , Toshihiko Kariya
- Applicant: Naoki Kato , Toshihiko Kariya
- Applicant Address: JP Aichi
- Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
- Current Assignee: Mitsubishi Heavy Industries Plastic Technology Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Birch, Stewart, Kolach & Birch, LLP
- Priority: JP2007-311542 20071130
- International Application: PCT/JP2008/057021 WO 20080409
- International Announcement: WO2009/069324 WO 20090604
- Main IPC: B29C45/64
- IPC: B29C45/64

Abstract:
In a mold clamping device including a fixed platen, a movable platen, a plurality of tie bars, and mold clamping half nuts, a pair of additional half members which is restricted in the axial direction of the tie bar and moves in an opening/closing direction of the half nuts relative to the mold clamping half nuts is further provided, and when the mold clamping half nuts are closed and mated with the screw or the ring groove of the tie bar, the additional half members are closed to hold the tie bar so that play at mated parts is removed or cancelled by fixation.
Public/Granted literature
- US20100227014A1 MOLD CLAMPING DEVICE Public/Granted day:2010-09-09
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