Invention Grant
- Patent Title: Low profile socket connector with improved contacts
- Patent Title (中): 薄型插座连接器，具有改进的触点
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Application No.: US13032646Application Date: 2011-02-23
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Publication No.: US08366452B2Publication Date: 2013-02-05
- Inventor: Cheng-Chi Yeh
- Applicant: Cheng-Chi Yeh
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: TW99206347 20100409
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A socket connector includes an insulative housing with a plurality of receiving holes, and a plurality of contacts received in the receiving holes. The contact has a soldering portion, and a retaining arm and a resilient arm respectively extending upwardly from the soldering portion. The retaining arm has a broken edge facing downward, which is formed by breaking a carrier from the contact.
Public/Granted literature
- US20110250794A1 LOW PROFILE SOCKET CONNECTOR WITH IMPROVED CONTACTS Public/Granted day:2011-10-13
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