Invention Grant
- Patent Title: Socket for electrical component
- Patent Title (中): 电气元件插座
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Application No.: US12975856Application Date: 2010-12-22
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Publication No.: US08366454B2Publication Date: 2013-02-05
- Inventor: Hirohisa Ohno
- Applicant: Hirohisa Ohno
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Kubotera & Associates, LLC
- Priority: JP2009-295258 20091225
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).
Public/Granted literature
- US20110159714A1 SOCKET FOR ELECTRICAL COMPONENT Public/Granted day:2011-06-30
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