Invention Grant
- Patent Title: Placing sutures
- Patent Title (中): 放置缝线
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Application No.: US12902676Application Date: 2010-10-12
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Publication No.: US08366725B2Publication Date: 2013-02-05
- Inventor: Michael S. H. Chu
- Applicant: Michael S. H. Chu
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Brown Rudnick LLP
- Main IPC: A61B17/04
- IPC: A61B17/04

Abstract:
A suturing instrument including multiple needle and suture assemblies that are at least partially disposed within the suturing instrument allows a surgeon to place multiple sutures intercorporally without having to remove the instrument from a surgical site and reload the instrument between placing each suture. The suturing instrument includes an elongate body member that includes a distal portion defining an opening. The suturing instrument further includes a first needle disposed within the opening, a second needle disposed within the opening, and a needle deployment mechanism disposed at least partially within the elongate body member and connectable sequentially to the first needle and the second needle.
Public/Granted literature
- US20110028999A1 PLACING SUTURES Public/Granted day:2011-02-03
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