Invention Grant
- Patent Title: Expandable implant, instrument, and method
- Patent Title (中): 可扩展植入物,仪器和方法
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Application No.: US13073748Application Date: 2011-03-28
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Publication No.: US08366779B2Publication Date: 2013-02-05
- Inventor: Andrew M. Dickson , Danny H. Braddock, Jr. , James S. Harrop , Dean G. Karaholios , Eric A. Potts , Christopher I. Shaffrey
- Applicant: Andrew M. Dickson , Danny H. Braddock, Jr. , James S. Harrop , Dean G. Karaholios , Eric A. Potts , Christopher I. Shaffrey
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
Embodiments of the invention include expandable, implantable devices and methods. Devices expand linearly to provide secure fixation between or among anatomical structures. In some embodiments, an implant replaces one or more vertebral bodies of the spine.
Public/Granted literature
- US20110172779A1 Expandable Implant, Instrument, and Method Public/Granted day:2011-07-14
Information query
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