Invention Grant
- Patent Title: Removing and segregating components from printed circuit boards
- Patent Title (中): 从印刷电路板上拆下和分离组件
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Application No.: US13131111Application Date: 2010-08-09
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Publication No.: US08366874B2Publication Date: 2013-02-05
- Inventor: Mark Meloni
- Applicant: Mark Meloni
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development LLC
- Current Assignee: Empire Technology Development LLC
- Current Assignee Address: US DE Wilmington
- International Application: PCT/US2010/044860 WO 20100809
- International Announcement: WO2012/021120 WO 20120216
- Main IPC: B32B38/10
- IPC: B32B38/10
Abstract:
Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.
Public/Granted literature
- US20120031566A1 Removing and Segregating Components from Printed Circuit Boards Public/Granted day:2012-02-09
Information query
