Invention Grant
- Patent Title: Liquid-ejection head and method for manufacturing liquid-ejection head substrate
- Patent Title (中): 液体喷射头和液体喷射头基板的制造方法
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Application No.: US12204802Application Date: 2008-09-05
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Publication No.: US08366950B2Publication Date: 2013-02-05
- Inventor: Mitsuru Chida , Toshiyasu Sakai , Noriyasu Ozaki , Hiroyuki Abo , Kazuya Abe , Kenji Ono
- Applicant: Mitsuru Chida , Toshiyasu Sakai , Noriyasu Ozaki , Hiroyuki Abo , Kazuya Abe , Kenji Ono
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2007-231356 20070906
- Main IPC: G01D15/00
- IPC: G01D15/00

Abstract:
A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.
Public/Granted literature
- US20090065474A1 LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE Public/Granted day:2009-03-12
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