Invention Grant
- Patent Title: Liquid discharge head and method of manufacturing a substrate for the liquid discharge head
- Patent Title (中): 液体排出头及液体排出头用基板的制造方法
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Application No.: US12629238Application Date: 2009-12-02
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Publication No.: US08366951B2Publication Date: 2013-02-05
- Inventor: Masafumi Morisue , Takumi Suzuki , Masahiko Kubota , Ryoji Kanri , Akihiko Okano , Atsushi Hiramoto
- Applicant: Masafumi Morisue , Takumi Suzuki , Masahiko Kubota , Ryoji Kanri , Akihiko Okano , Atsushi Hiramoto
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2008-323787 20081219
- Main IPC: G01D15/00
- IPC: G01D15/00

Abstract:
A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.
Public/Granted literature
- US20100156990A1 LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE LIQUID DISCHARGE HEAD Public/Granted day:2010-06-24
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