Invention Grant
- Patent Title: Etching solutions
- Patent Title (中): 蚀刻解决方案
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Application No.: US11910855Application Date: 2006-04-05
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Publication No.: US08366958B2Publication Date: 2013-02-05
- Inventor: Kwang-Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
- Applicant: Kwang-Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
- Applicant Address: KR Ansan
- Assignee: Inktec Co., Ltd.
- Current Assignee: Inktec Co., Ltd.
- Current Assignee Address: KR Ansan
- Agency: The Webb Law Firm
- Priority: KR10-2005-0028508 20050406
- International Application: PCT/KR2006/001263 WO 20060405
- International Announcement: WO2006/107176 WO 20061012
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09K13/06
Abstract:
The present invention provides an etching solution for silver or silver alloy including at one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.
Public/Granted literature
- US20080277381A1 Etching Solutions Public/Granted day:2008-11-13
Information query
