A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.