Invention Grant
- Patent Title: Thin film of metal-silicon compound and process for producing the thin film of the metal-silicon compound
- Patent Title (中): 金属硅化合物薄膜和金属硅化合物薄膜的制造方法
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Application No.: US12919443Application Date: 2009-02-25
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Publication No.: US08367030B2Publication Date: 2013-02-05
- Inventor: Toshihiko Kanayama , Noriyuki Uchida
- Applicant: Toshihiko Kanayama , Noriyuki Uchida
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Kagan Binder, PLLC
- Priority: JP2008-048520 20080228; JP2008-230650 20080909; JP2009-037261 20090220
- International Application: PCT/JP2009/053422 WO 20090225
- International Announcement: WO2009/107669 WO 20090903
- Main IPC: C01B21/068
- IPC: C01B21/068

Abstract:
The present invention relates to a thin film of a metal-silicon compound and a process for producing the thin film of the metal-silicon compound. The metal-silicon compound is a compound of a transition metal and silicon, and has a transition metal-containing silicon cluster as a unit structure, the transition metal-containing silicon cluster having a structure in which a transition metal atom is surrounded by seven to sixteen silicon atoms, two of which are first and second neighbor atoms to the transition metal atom.
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