Invention Grant
- Patent Title: Radio-frequency microelectromechanical systems and method of manufacturing such systems
- Patent Title (中): 射频微机电系统及其制造方法
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Application No.: US10578027Application Date: 2004-10-26
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Publication No.: US08367215B2Publication Date: 2013-02-05
- Inventor: Jacob M. J. Den Toonder , Auke R. Van Dijken , Theodoor G. S. M. Rijks , Jozef T. M. Van Beek
- Applicant: Jacob M. J. Den Toonder , Auke R. Van Dijken , Theodoor G. S. M. Rijks , Jozef T. M. Van Beek
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: EP03104044 20031031
- International Application: PCT/IB2004/052201 WO 20041026
- International Announcement: WO2005/043572 WO 20050512
- Main IPC: B32B15/00
- IPC: B32B15/00
Abstract:
An RF MEMS device comprising one or more free-standing thin films configured for motion in response to actuation or stimulation, the one or more thin films comprising an alloy of aluminum and magnesium, and optionally one or more further materials. The resultant thin film has improved hardness and reduced creep relative to conventional thin films.
Public/Granted literature
- US20100255322A1 Radio-Frequency Microelectromechanical Systems and Method of Manufacturing such Systems Public/Granted day:2010-10-07
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