Invention Grant
- Patent Title: Manufacturing method of semiconductor photonic device substrate
- Patent Title (中): 半导体光子器件衬底的制造方法
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Application No.: US12766684Application Date: 2010-04-23
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Publication No.: US08367431B2Publication Date: 2013-02-05
- Inventor: Toshihiro Morisawa , Takehiko Tani , Hisataka Nagai , Takashi Furuya
- Applicant: Toshihiro Morisawa , Takehiko Tani , Hisataka Nagai , Takashi Furuya
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2009-159182 20090703
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
In a manufacturing method of a semiconductor photonic device substrate, before multi-layer films different in material composition are successively and gradually crystal-grown in one chamber, an inter-layer growth rate model showing a relation in growth rate between each layer is defined, a growth rate of a film corresponding to at least one or more layers is obtained by actual crystal growth using an individual substrate, a growth rate of a film corresponding to other layers is estimated from the obtained growth rate by the inter-layer growth rate model, and a growth time is determined in accordance with a film thickness of each layer of the semiconductor photonic device substrate based on the actually obtained growth rate and the estimated growth rate. These steps are carried out by using a computer system connected to an MOCVD equipment, and then, a crystal growth of the semiconductor photonic device substrate is performed.
Public/Granted literature
- US20110003413A1 MANUFACTURING METHOD OF SEMICONDUCTOR PHOTONIC DEVICE SUBSTRATE Public/Granted day:2011-01-06
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