Invention Grant
- Patent Title: Semiconductor light-emitting apparatus and method of manufacturing the same
- Patent Title (中): 半导体发光装置及其制造方法
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Application No.: US13026564Application Date: 2011-02-14
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Publication No.: US08367449B2Publication Date: 2013-02-05
- Inventor: Chiharu Sasaki , Wataru Tamura , Keita Akiyama
- Applicant: Chiharu Sasaki , Wataru Tamura , Keita Akiyama
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2010-031295 20100216
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L21/00

Abstract:
A semiconductor light-emitting apparatus that has high luminous efficiency and a high breakdown voltage as well as reduced breakdown voltage variation among lots. The semiconductor light-emitting apparatus includes a first clad layer and a second clad layer. An average dopant concentration of the second clad layer is lower than that of the first clad layer. The light-emitting apparatus also includes an active layer having an average dopant concentration of 2×1016 to 4×1016 cm−3. The active layer is made of (AlyGa1-y)xIn1-xP (0
Public/Granted literature
- US20110198634A1 SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-08-18
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