Invention Grant
- Patent Title: Integrated circuit package on package system
- Patent Title (中): 封装系统集成电路封装
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Application No.: US11276942Application Date: 2006-03-17
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Publication No.: US08367465B2Publication Date: 2013-02-05
- Inventor: DongSam Park , Choong Bin Yim , In Sang Yoon
- Applicant: DongSam Park , Choong Bin Yim , In Sang Yoon
- Applicant Address: SG Singapore
- Assignee: STATS Chippac Ltd.
- Current Assignee: STATS Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.
Public/Granted literature
- US20070216006A1 INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM Public/Granted day:2007-09-20
Information query
IPC分类:
