Invention Grant
- Patent Title: Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
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Application No.: US13096496Application Date: 2011-04-28
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Publication No.: US08367468B2Publication Date: 2013-02-05
- Inventor: Yasuhiro Yamaji , Tokihiko Yokoshima , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi
- Applicant: Yasuhiro Yamaji , Tokihiko Yokoshima , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2006-189916 20060711; JP2007-135948 20070522
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L23/48
Abstract:
An electrode connection structure of a semiconductor chip is provided to realize a highly reliable electrical connection with low stress without using a bump. A conductive member may be used for such an electrode connection structure. A semiconductor device is provided wherein semiconductor chips are arranged in layers without providing the semiconductor chips with a through via, and a method is provided for manufacturing such a semiconductor device. A part or all of the surface of a horizontal recess, which is formed in an adhesive layer arranged between a first electrode of a lower layer and a second electrode of an upper layer, is provided with a conductive member for connecting the first electrode and the second electrode.
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