Invention Grant
- Patent Title: Method and system for internal layer-layer thermal enhancement
- Patent Title (中): 内层热增强方法和系统
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Application No.: US13151672Application Date: 2011-06-02
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Publication No.: US08367478B2Publication Date: 2013-02-05
- Inventor: Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , David R. Motschman
- Applicant: Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , David R. Motschman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Stachler Intellectual Property Law LLC
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L23/34 ; H01L23/52 ; H01L23/48 ; H01L23/40 ; H01L23/538
Abstract:
The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.
Public/Granted literature
- US20120306088A1 METHOD AND SYSTEM FOR INTERNAL LAYER-LAYER THERMAL ENHANCEMENT Public/Granted day:2012-12-06
Information query
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