Invention Grant
- Patent Title: Semiconductor device and fabrication method
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13558467Application Date: 2012-07-26
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Publication No.: US08367532B2Publication Date: 2013-02-05
- Inventor: Anton Mauder , Hans-Joachim Schulze , Frank Hille , Holger Schulze , Manfred Pfaffenlehner , Carsten Schäffer , Franz-Josef Niedernostheide
- Applicant: Anton Mauder , Hans-Joachim Schulze , Frank Hille , Holger Schulze , Manfred Pfaffenlehner , Carsten Schäffer , Franz-Josef Niedernostheide
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: SpryIP, LLC
- Priority: DE102004047749 20040930
- Main IPC: H01L21/265
- IPC: H01L21/265

Abstract:
A semiconductor device in one embodiment has a first connection region, a second connection region and a semiconductor volume arranged between the first and second connection regions. Provision is made, within the semiconductor volume, in the vicinity of the second connection region, of a field stop zone for spatially delimiting a space charge zone that can be formed in the semiconductor volume, and of an anode region adjoining the first connection region. The dopant concentration profile within the semiconductor volume is configured such that the integral of the ionized dopant charge over the semiconductor volume, proceeding from an interface of the anode region which faces the second connection region, in the direction of the second connection region, reaches a quantity of charge corresponding to the breakdown charge of the semiconductor device only near the interface of the field stop zone which faces the second connection region.
Public/Granted literature
- US20120315747A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD Public/Granted day:2012-12-13
Information query
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