Invention Grant
- Patent Title: Methods and systems of transferring, docking and processing substrates
- Patent Title (中): 转移，对接和处理基材的方法和系统
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Application No.: US12973736Application Date: 2010-12-20
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Publication No.: US08367565B2Publication Date: 2013-02-05
- Inventor: Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
- Applicant: Lawrence Chung-Lai Lei , Alfred Mak , Rex Liu , Kon Park , Samuel S. Pak , Tzy-Chung Terry Wu , Simon Zhu , Ronald L. Rose , Gene Shin , Xiaoming Wang
- Applicant Address: KY Georgetown
- Assignee: Archers Inc.
- Current Assignee: Archers Inc.
- Current Assignee Address: KY Georgetown
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
In accordance with some embodiments described herein, a method for transferring a substrate is provided. The method includes loading one or more substrates into a respective mobile chamber of one or more mobile chambers. The mobile chambers are movable on a first rail positioned adjacent to two or more process modules. Each mobile chamber is configured to maintain a specified gas condition. The respective mobile chamber is moved along the first rail. The respective mobile chamber is docked to a respective process module of the two or more process modules. At least one of the one or more substrates is conveyed from the respective mobile chamber to the respective process module.
Public/Granted literature
- US20110217469A1 Methods and Systems of Transferring, Docking and Processing Substrates Public/Granted day:2011-09-08
Information query
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