Invention Grant
- Patent Title: Encapsulant compositions and method for fabricating encapsulant materials
- Patent Title (中): 密封剂组合物及其制造方法
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Application No.: US12639467Application Date: 2009-12-16
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Publication No.: US08367768B2Publication Date: 2013-02-05
- Inventor: Lung-Chang Liu , Ming-Hua Chung , Tsung-Ju Hsu , Chih-Fen Chang , Jen-Hao Chen
- Applicant: Lung-Chang Liu , Ming-Hua Chung , Tsung-Ju Hsu , Chih-Fen Chang , Jen-Hao Chen
- Applicant Address: TW Hsinchu County
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu County
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: GB0822911.4 20081216
- Main IPC: C08F2/46
- IPC: C08F2/46 ; B29B13/08 ; B05D5/00
Abstract:
An encapsulant composition is provided. The encapsulant composition includes at least one silane-containing monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.
Public/Granted literature
- US20100148666A1 ENCAPSULANT COMPOSITIONS AND METHOD FOR FABRICATING ENCAPSULANT MATERIALS Public/Granted day:2010-06-17
Information query
