Invention Grant
US08367929B2 Microcavity structure and encapsulation structure for a microelectronic device 有权
微电子器件的微腔结构和封装结构

Microcavity structure and encapsulation structure for a microelectronic device
Abstract:
A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.
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