Invention Grant
- Patent Title: Grounding mechanism for electronic device
- Patent Title (中): 电子设备接地机构
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Application No.: US12845917Application Date: 2010-07-29
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Publication No.: US08367930B2Publication Date: 2013-02-05
- Inventor: Shi-Xu Liang
- Applicant: Shi-Xu Liang
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010133608 20100326
- Main IPC: H05K4/02
- IPC: H05K4/02

Abstract:
A grounding mechanism is used for an electronic device. The electronic device includes a housing and a battery cover. The grounding mechanism typically includes an elastic member including a main portion, a first bent portion, a second bent portion and a clamping portion. The main portion is attached to the housing. The first bent portion and the second bent portion respectively extend from two opposite ends of the main portion. The clamping portion extends from one side of the main portion, and includes two arms for clamping one part of the battery cover.
Public/Granted literature
- US20110232935A1 GROUNDING MECHANISM FOR ELECTRONIC DEVICE Public/Granted day:2011-09-29
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