Invention Grant
US08367937B2 Printed circuit board with a signal line pair and method of manufacturing the same 有权
具有信号线对的印刷电路板及其制造方法

Printed circuit board with a signal line pair and method of manufacturing the same
Abstract:
A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.
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