Invention Grant
- Patent Title: Printed circuit board with a signal line pair and method of manufacturing the same
- Patent Title (中): 具有信号线对的印刷电路板及其制造方法
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Application No.: US12549993Application Date: 2009-08-28
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Publication No.: US08367937B2Publication Date: 2013-02-05
- Inventor: Voonyee Ho , Takeshi Tanaka , Masami Inoue , Martin John McCaslin
- Applicant: Voonyee Ho , Takeshi Tanaka , Masami Inoue , Martin John McCaslin
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2008-226393 20080903
- Main IPC: H05K1/09
- IPC: H05K1/09

Abstract:
A first insulating layer is formed on a suspension body. A write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer to cover the write wiring trace. A write wiring trace and read wiring traces are formed on the second insulating layer. The write wiring trace is arranged above the write wiring trace. The write wiring trace includes a conductor layer and reinforcing alloy layers. The reinforcing alloy layers are sequentially formed to cover an upper surface and side surfaces of the conductor layer.
Public/Granted literature
- US20100051334A1 Printed Circuit Board and Method of Manufacturing the Same Public/Granted day:2010-03-04
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