Invention Grant
US08367940B2 Encapsulation device and method, microcapsule incorporating this device
有权
封装装置和方法,结合该装置的微胶囊
- Patent Title: Encapsulation device and method, microcapsule incorporating this device
- Patent Title (中): 封装装置和方法,结合该装置的微胶囊
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Application No.: US12872251Application Date: 2010-08-31
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Publication No.: US08367940B2Publication Date: 2013-02-05
- Inventor: Thierry Hilt , Xavier Baillin
- Applicant: Thierry Hilt , Xavier Baillin
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Current Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Occhiuti Rohlicek & Tsao LLP
- Priority: FR0955975 20090902
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
The invention concerns a device for encapsulating an element within a microcavity made on a support (10), this device comprising an encapsulating membrane (12) capable of forming at least one part of the microcavity,characterized in that the device comprises at least one arm which mechanically attaches the membrane to the support, this arm being capable of bending so as to shift the membrane between: an open position in which the membrane overhangs the element to be encapsulated and its periphery defines an aperture extending around the element to be encapsulated, and a shut position in which the periphery of the encapsulation membrane rests on the support to obstruct this aperture.
Public/Granted literature
- US20110052879A1 ENCAPSULATION DEVICE AND METHOD, MICROCAPSULE INCORPORATING THIS DEVICE Public/Granted day:2011-03-03
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