An electrical interposer for connecting two electronic devices includes a plurality of first cores with undulating structure extending in a first direction and a plurality of second cores with undulating structure extending in a second direction angular with the first direction. Each first core has first peaks and first valleys alternately arranged in the first direction and each first peak is electrically connected with a corresponding neighboring first valley but insulated from others. Each second core has second peaks and second valleys alternately arranged in the second direction and each second peak is electrically connected with a corresponding neighboring second valley but insulated from others. The first cores and the second cores interlace with each other to reach a woven structure with the first peaks and the second peaks jointly constituting an upper interface, and the first valleys and the second valleys jointly constituting a lower interface.